The **ATS-10F-92-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-10F-92-C2-R0 | | **Base Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) | | **Thermal Resistance** | 1.96°C/W (Ducted Flow @ 200 LFM) | | **Weight** | ~40.54 grams | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and component clearance. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 15.00 mm * **Fin Pitch:** Fine-Pitch (increases surface area for better dissipation) * **Hole Pattern:** 45.00 mm x 45.00 mm (diagonal/square spacing for pushpins) --- ### 3. Key Component Features #### A. pushPIN™ Attachment Unlike adhesive tapes or clips, the pushPIN™ system uses a flexible, spring-loaded mechanism. * **Benefit:** Provides consistent pressure across the component surface for maximum heat transfer. * **Reliability:** It is more secure than thermal tape in high-vibration environments. #### B. Heat Sink Design (Fine-Pitch) This model features a **Straight Fin** design with a fine pitch. * **Efficiency:** It is optimized for high-performance air cooling. * **Material:** Aluminum 6063 is used for its excellent thermal conductivity and lightweight properties. #### C. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: 1. **Corrosion Resistance:** Protects the aluminum from oxidation. 2. **Emissivity:** Slightly improves heat radiation compared to raw aluminum. --- ### 4. Application and Usage This part is typically used for cooling: * **CPUs/GPUs:** In embedded systems or small form factor PCs. * **FPGAs/ASICs:** In telecommunications and networking gear. * **Power Modules:** Where high thermal density requires a reliable mechanical attachment.