The **ATS-10F-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below is a breakdown of the key physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Spring-loaded) | | **Dimensions (LxW)** | 40mm x 40mm | | **Height** | 25mm | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | ~5.63 °C/W (at 100 LFM) | --- ### 2. Component Features * **Heat Sink Material:** Made of aluminum, providing a lightweight yet thermally conductive path to dissipate heat away from the silicon die. * **Fin Design:** It utilizes a **Fine-Pitch** pattern. This maximizes surface area in a small footprint, allowing for better heat transfer via convection. * **Attachment Mechanism:** The "C2" in the part number indicates the use of a specific push-pin and spring kit. This ensures a constant, high-pressure contact between the heat sink and the component, which is critical for reducing thermal interface resistance. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material or similar, ensuring immediate out-of-the-box readiness for mounting. --- ### 3. Part Number Decoder Understanding the nomenclature helps in selecting the correct variant for your PCB design: | Segment | Meaning | Detail | | :--- | :--- | :--- | | **ATS-10** | Series | Part of the pushPIN™ HS collection | | **F** | Fin Type | "F" usually denotes a specific fine-pitch layout | | **96** | Dimension Code | Specific internal sizing reference | | **C2** | Thermal Material/Pin | Aluminum construction with specific TIM/Spring kit | | **R0** | Revision | Specific RoHS compliant revision code | --- ### 4. Application Use Cases The ATS-10F-96-C2-R0 is typically used in environments where airflow is present (forced convection) to cool: * **FPGAs & ASICs:** High-speed processors that generate significant localized heat. * **Network Switches:** Cooling of high-speed communication chips. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. ---