The **ATS-10G-101-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** heat sink designed for high-density electronic cooling applications. ### 1. General Specifications The part belongs to the **maxiFLOW™** series, known for its unique flared fin geometry which maximizes surface area for convection cooling. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10G-101-C3-R0 | | **Component Type** | Heat Sink | | **Attachment Method** | superGRIP™ (Clip-on) | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with adjacent components. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 40.00 mm x 40.00 mm | | **Height** | 24.50 mm | | **Fin Style** | Flared (maxiFLOW) | --- ### 3. Technical Performance Features This specific part is engineered for high-heat flux chips (like CPUs, FPGAs, or GPUs). * **Flared Fin Design:** The fins spread outward to increase the "effective" footprint of the heat sink, allowing it to capture more airflow than a standard straight-fin design. * **superGRIP™ Attachment:** This is a high-reliability mechanical attachment system. It uses a plastic frame (clip) that snaps onto the component without requiring holes in the PCB, reducing mechanical stress on the solder joints. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal pad (usually **Chomerics T766**) to bridge the gap between the component and the metal. --- ### 4. Thermal Resistance (Example Data) Performance varies based on the Airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM | ~1.30 °C/W | | 400 LFM | ~1.00 °C/W | | 600 LFM | ~0.85 °C/W | --- ### 5. Material Safety and Compliance ```json { "compliance": "RoHS Compliant", "material": "Aluminum 6063", "application": "Telecom, Networking, Data Centers" } ```