ATS-10H-33-C2-R0
AI

The **ATS-10H-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, known for its high-efficiency cooling in constrained spaces.
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### 1. Technical Specifications
Below are the primary technical parameters for this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 17.42°C/W (Unducted) @ 100 LFM |
| **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 17.78mm |
| **Recommended Springs** | ATS-PPS-10 |
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### 2. Key Design Features
* **maxiFLOW™ Fin Pattern:** The heatsink uses a flared fin design. This maximizes the surface area for heat dissipation while increasing the turbulence of the airflow, which significantly improves thermal performance compared to standard straight-fin heatsinks.
* **pushPIN™ Attachment:** This model uses the proprietary pushPIN™ mechanism. This ensures a secure and consistent pressure (clamping force) on the electronic component, which is critical for maintaining an effective thermal interface.
* **Material and Coating:** It is made of lightweight aluminum for good thermal conductivity and features a **Blue Anodized** finish, which provides corrosion resistance and improved emissivity.
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### 3. Application Use Cases
The ATS-10H-33-C2-R0 is typically used to cool critical integrated circuits (ICs) such as:
1. **Processors (CPUs/GPUs):** Small form factor embedded processors.
2. **FPGAs & ASICs:** High-speed chips used in networking and telecommunications.
3. **Power Electronics:** Voltage regulators or power modules that generate concentrated heat.
4. **Telecommunications:** Cooling components inside routers, switches, and base stations where airflow is often directed.
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### 4. Comparison of Airflow Performance
Thermal resistance changes based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 17.42 |
| 300 (1.5 m/s) | 7.03 |
| 500 (2.5 m/s) | 4.10 |
| 700 (3.5 m/s) | 3.06 |
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- ⤷
What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ How do I select the correct pushPIN interface for my PCB thickness?
- ⤷ What thermal interface material (TIM) is recommended for the ATS-10H-33-C2-R0?