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  • ATS-10H-33-C2-R0

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    The **ATS-10H-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, known for its high-efficiency cooling in constrained spaces. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 17.42°C/W (Unducted) @ 100 LFM | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 17.78mm | | **Recommended Springs** | ATS-PPS-10 | --- ### 2. Key Design Features * **maxiFLOW™ Fin Pattern:** The heatsink uses a flared fin design. This maximizes the surface area for heat dissipation while increasing the turbulence of the airflow, which significantly improves thermal performance compared to standard straight-fin heatsinks. * **pushPIN™ Attachment:** This model uses the proprietary pushPIN™ mechanism. This ensures a secure and consistent pressure (clamping force) on the electronic component, which is critical for maintaining an effective thermal interface. * **Material and Coating:** It is made of lightweight aluminum for good thermal conductivity and features a **Blue Anodized** finish, which provides corrosion resistance and improved emissivity. --- ### 3. Application Use Cases The ATS-10H-33-C2-R0 is typically used to cool critical integrated circuits (ICs) such as: 1. **Processors (CPUs/GPUs):** Small form factor embedded processors. 2. **FPGAs & ASICs:** High-speed chips used in networking and telecommunications. 3. **Power Electronics:** Voltage regulators or power modules that generate concentrated heat. 4. **Telecommunications:** Cooling components inside routers, switches, and base stations where airflow is often directed. --- ### 4. Comparison of Airflow Performance Thermal resistance changes based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 17.42 | | 300 (1.5 m/s) | 7.03 | | 500 (2.5 m/s) | 4.10 | | 700 (3.5 m/s) | 3.06 | ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ How do I select the correct pushPIN interface for my PCB thickness?
    • ⤷ What thermal interface material (TIM) is recommended for the ATS-10H-33-C2-R0?