ATS-10H-40-C2-R0
AI

The **ATS-10H-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### ## Technical Specifications
Below is a breakdown of the physical and thermal characteristics of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Base Part Number** | ATS-10H-40-C2-R0 |
| **Material** | Aluminum |
| **Dimensions** | 47.62mm x 47.62mm (Base) |
| **Height** | 25.00mm |
| **Attachment Method** | pushPIN™ |
| **Fin Type** | High-Efficiency (Straight/Cross-Cut) |
| **Thermal Resistance** | 1.05°C/W (at 200 LFM) |
| **Finish** | Blue Anodized |
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### ### Key Components & Design Features
#### 1. Material and Finish
The unit is made from **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The **Blue Anodized** coating provides corrosion resistance and increases surface emissivity, which helps slightly with radiation cooling.
#### 2. pushPIN™ Attachment
Unlike adhesive-based heat sinks, this part uses a **pushPIN™** mechanism:
* **Spring-loaded:** Ensures consistent pressure between the heat sink and the chip.
* **Reliability:** Prevents the heat sink from shifting or falling off due to vibration or thermal expansion.
* **TIM (Thermal Interface Material):** Usually comes pre-applied with a high-performance thermal phase-change material or grease.
#### 3. Airflow Efficiency
The "H" in the part number often refers to the **High-Efficiency** fin profile. The fin spacing and thickness are optimized for forced air (fan cooling). It performs best in environments where there is a steady stream of air (measured in Linear Feet per Minute - LFM).
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### ### Thermal Performance Summary
Heat sinks are rated by their thermal resistance. A lower number is better:
* **At 200 LFM:** ~1.05 °C/W
* **At 400 LFM:** ~0.65 °C/W
* **At 600 LFM:** ~0.50 °C/W
*Note: As airflow increases, the heat sink's ability to transfer heat to the environment improves significantly.*
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- ⤷
What are the mechanical requirements for the pushPIN mounting holes on a PCB?
- ⤷ How does 'Blue Anodized' finish compare to 'Black Anodized' in terms of thermal performance?
- ⤷ Can this heat sink be used for passive cooling without a fan?