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  • ATS-10H-40-C2-R0

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    The **ATS-10H-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Part Number** | ATS-10H-40-C2-R0 | | **Material** | Aluminum | | **Dimensions** | 47.62mm x 47.62mm (Base) | | **Height** | 25.00mm | | **Attachment Method** | pushPIN™ | | **Fin Type** | High-Efficiency (Straight/Cross-Cut) | | **Thermal Resistance** | 1.05°C/W (at 200 LFM) | | **Finish** | Blue Anodized | --- ### ### Key Components & Design Features #### 1. Material and Finish The unit is made from **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The **Blue Anodized** coating provides corrosion resistance and increases surface emissivity, which helps slightly with radiation cooling. #### 2. pushPIN™ Attachment Unlike adhesive-based heat sinks, this part uses a **pushPIN™** mechanism: * **Spring-loaded:** Ensures consistent pressure between the heat sink and the chip. * **Reliability:** Prevents the heat sink from shifting or falling off due to vibration or thermal expansion. * **TIM (Thermal Interface Material):** Usually comes pre-applied with a high-performance thermal phase-change material or grease. #### 3. Airflow Efficiency The "H" in the part number often refers to the **High-Efficiency** fin profile. The fin spacing and thickness are optimized for forced air (fan cooling). It performs best in environments where there is a steady stream of air (measured in Linear Feet per Minute - LFM). --- ### ### Thermal Performance Summary Heat sinks are rated by their thermal resistance. A lower number is better: * **At 200 LFM:** ~1.05 °C/W * **At 400 LFM:** ~0.65 °C/W * **At 600 LFM:** ~0.50 °C/W *Note: As airflow increases, the heat sink's ability to transfer heat to the environment improves significantly.* ---
    ✨ Follow-up Questions
    • ⤷ What are the mechanical requirements for the pushPIN mounting holes on a PCB?
    • ⤷ How does 'Blue Anodized' finish compare to 'Black Anodized' in terms of thermal performance?
    • ⤷ Can this heat sink be used for passive cooling without a fan?