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  • ATS-10H-67-C2-R0

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    The **ATS-10H-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 20.30° C/W (at 100 LFM) | | **Flow Direction** | Cross-cut (Multiple directions) | --- ### 2. Key Design Features * **Heat Sink Profile:** This is a low-profile heat sink (10mm height), making it ideal for thin electronic enclosures or 1U server racks where vertical space is limited. * **pushPIN™ Attachment:** The "H" in the part number often refers to the specific attachment style. The push-pin system provides a secure, vibration-resistant mount to the PCB using a pre-drilled hole pattern. * **High-Performance Interface Material:** These units usually come with a pre-applied **Thermal Interface Material (TIM)**, specifically "T766" or similar high-conductivity grease, to ensure maximum heat transfer from the component to the aluminum fins. * **Aluminum Construction:** Aluminum provides a balance between lightweight design and high thermal conductivity, while the **Blue Anodized** coating protects the metal from corrosion and improves emissivity. --- ### 3. Application Use Cases The ATS-10H-67-C2-R0 is typically used in the following scenarios: 1. **Embedded Systems:** Cooling SoCs (System on Chips) in industrial automation. 2. **Telecommunications:** Dissipating heat from high-speed networking chips. 3. **Power Electronics:** Managing heat for MOSFETs or Voltage Regulators in power supplies. --- ### 4. Part Number Breakdown (Example Decoding) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **10H** | Height / Series Identifier | | **67** | Length/Width Dimensions (45mm footprint) | | **C2** | Thermal Performance/Material Grade | | **R0** | RoHS Compliant / Revision Status |
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern dimensions required for mounting this heat sink?
    • ⤷ How does the thermal resistance change at higher airflows (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Does this part come with plastic or brass push-pins by default?