ATS-10H-67-C2-R0
AI

The **ATS-10H-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
### 1. Technical Specifications
The following table summarizes the primary physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance** | 20.30° C/W (at 100 LFM) |
| **Flow Direction** | Cross-cut (Multiple directions) |
---
### 2. Key Design Features
* **Heat Sink Profile:** This is a low-profile heat sink (10mm height), making it ideal for thin electronic enclosures or 1U server racks where vertical space is limited.
* **pushPIN™ Attachment:** The "H" in the part number often refers to the specific attachment style. The push-pin system provides a secure, vibration-resistant mount to the PCB using a pre-drilled hole pattern.
* **High-Performance Interface Material:** These units usually come with a pre-applied **Thermal Interface Material (TIM)**, specifically "T766" or similar high-conductivity grease, to ensure maximum heat transfer from the component to the aluminum fins.
* **Aluminum Construction:** Aluminum provides a balance between lightweight design and high thermal conductivity, while the **Blue Anodized** coating protects the metal from corrosion and improves emissivity.
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### 3. Application Use Cases
The ATS-10H-67-C2-R0 is typically used in the following scenarios:
1. **Embedded Systems:** Cooling SoCs (System on Chips) in industrial automation.
2. **Telecommunications:** Dissipating heat from high-speed networking chips.
3. **Power Electronics:** Managing heat for MOSFETs or Voltage Regulators in power supplies.
---
### 4. Part Number Breakdown (Example Decoding)
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **10H** | Height / Series Identifier |
| **67** | Length/Width Dimensions (45mm footprint) |
| **C2** | Thermal Performance/Material Grade |
| **R0** | RoHS Compliant / Revision Status |
- ⤷
What is the hole pattern dimensions required for mounting this heat sink?
- ⤷ How does the thermal resistance change at higher airflows (e.g.
- ⤷ 500 LFM)?
- ⤷ Does this part come with plastic or brass push-pins by default?