ATS-10H-75-C3-R0
AI

The **ATS-10H-75-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power transistors.
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### Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-10H-75-C3-R0 |
| **Heat Sink Type** | Push-Pin (Passive cooling) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 2.50°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm |
| **Attachment Method** | Push-pin with Brass Spring |
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### Component Breakdown
#### 1. Push-Pin Attachment
This part features a **Push-Pin** mounting mechanism. Unlike adhesive-based heat sinks, the push-pin uses a spring-loaded fastener that goes through pre-drilled holes in the PCB.
- **Benefit:** Provides consistent pressure for better thermal transfer and allows for easy removal/rework.
#### 2. Thermal Interface Material (TIM)
The "C3" in the part number typically refers to the **Thermal Interface Material** pre-applied to the base of the heat sink.
- **Type:** ATS-10H-75-C3-R0 usually comes with **T766** phase-change material or a similar high-performance grease.
- **Function:** Fills microscopic air gaps between the component and the heat sink to maximize heat flow.
#### 3. Fin Profile (Cross-Cut)
The heat sink utilizes a **straight-fin or cross-cut design**. This is optimized for "forced convection," meaning it performs best when there is airflow (from a system fan) moving through the fins.
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### Application Usage
This component is typically found in:
* **Networking Equipment:** Routers and switches with high-speed processors.
* **Embedded Systems:** Industrial PCs where height is limited (only 10mm tall).
* **Power Supplies:** Cooling MOSFETs or power modules.
### Part Number Decoder
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **10H:** Height (10mm).
* **75:** Specific series/footprint dimensions.
* **C3:** Specific Thermal Interface Material (TIM) used.
* **R0:** RoHS Compliance status.
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What is the difference between push-pin and adhesive mounting for heat sinks?
- ⤷ How do I calculate if the 2.50°C/W thermal resistance is sufficient for my chip?
- ⤷ Are there taller versions of this heat sink for better cooling?