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  • ATS-10H-75-C3-R0

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    The **ATS-10H-75-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10H-75-C3-R0 | | **Heat Sink Type** | Push-Pin (Passive cooling) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Attachment Method** | Push-pin with Brass Spring | --- ### Component Breakdown #### 1. Push-Pin Attachment This part features a **Push-Pin** mounting mechanism. Unlike adhesive-based heat sinks, the push-pin uses a spring-loaded fastener that goes through pre-drilled holes in the PCB. - **Benefit:** Provides consistent pressure for better thermal transfer and allows for easy removal/rework. #### 2. Thermal Interface Material (TIM) The "C3" in the part number typically refers to the **Thermal Interface Material** pre-applied to the base of the heat sink. - **Type:** ATS-10H-75-C3-R0 usually comes with **T766** phase-change material or a similar high-performance grease. - **Function:** Fills microscopic air gaps between the component and the heat sink to maximize heat flow. #### 3. Fin Profile (Cross-Cut) The heat sink utilizes a **straight-fin or cross-cut design**. This is optimized for "forced convection," meaning it performs best when there is airflow (from a system fan) moving through the fins. --- ### Application Usage This component is typically found in: * **Networking Equipment:** Routers and switches with high-speed processors. * **Embedded Systems:** Industrial PCs where height is limited (only 10mm tall). * **Power Supplies:** Cooling MOSFETs or power modules. ### Part Number Decoder * **ATS:** Manufacturer (Advanced Thermal Solutions). * **10H:** Height (10mm). * **75:** Specific series/footprint dimensions. * **C3:** Specific Thermal Interface Material (TIM) used. * **R0:** RoHS Compliance status.
    ✨ Follow-up Questions
    • ⤷ What is the difference between push-pin and adhesive mounting for heat sinks?
    • ⤷ How do I calculate if the 2.50°C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there taller versions of this heat sink for better cooling?