### Overview of ATS-10H-79-C2-R0 The **ATS-10H-79-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for effective thermal management of electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### Technical Specifications The following table details the mechanical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Dimensions (L x W)** | 25.0 mm x 25.0 mm | | **Height (H)** | 20.0 mm | | **Pitch** | Fine-Pitch (increases surface area) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 26.36 °C/W (at 1.0 m/s airflow) | | **Flow Orientation** | Vertical or Horizontal (High-performance Cross-Cut) | --- ### Electronic and Thermal Functionality Although the heat sink itself is a passive mechanical component, it plays a critical role in electronics: 1. **Heat Dissipation:** It absorbs heat generated by the semiconductor die (via conduction) and transfers it to the surrounding air (via convection). 2. **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** thermal interface material, which fills microscopic air gaps between the chip and the heat sink base to ensure maximum heat transfer. 3. **Cross-Cut Design:** The fin pattern is designed to work with multi-directional airflow, making it versatile for dense PCB layouts where air might not flow in a single straight path. ### Mechanical Attachment (pushPIN™) The "79-C2-R0" designation refers to the specific mounting hardware: * **Push-Pins:** These provide a secure, vibration-resistant attachment to the PCB. * **Springs:** Compression springs ensure constant, even pressure across the electronic component, preventing damage while maintaining thermal contact. --- ### Application Usage * **Embedded Systems:** Used on small form-factor motherboards. * **Power Electronics:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** Cooling signal processing chips in network switches.