ATS-10H-83-C2-R0
AI

The **ATS-10H-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Parameter | Details |
| :--- | :--- |
| **Part Number** | ATS-10H-83-C2-R0 |
| **Heat Sink Type** | Push-Pin (Standard Square) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm |
| **Attachment Method** | Push-Pin (Plastic) with Spring |
| **Thermal Resistance** | Approx. 1.80°C/W (at 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Design Features
* **High-Performance Fin Pattern:** This model typically uses a **Straight Fin** or **Cross-Cut** pattern. This maximizes surface area while maintaining a low pressure drop, making it ideal for systems with forced-air cooling (fans).
* **Push-Pin Attachment:** The part uses a spring-loaded push-pin mechanism. This provides:
* **Consistent Pressure:** Ensures the heat sink is pressed firmly against the chip for maximum heat transfer.
* **Secure Mounting:** Resistant to vibration and shock compared to adhesive tapes.
* **T766 Phase Change Material:** The "C2" in the part number indicates it comes with a high-quality thermal interface material pre-applied to the base. This eliminates the need for manual thermal paste application.
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### 3. Part Number Breakdown
Understanding the nomenclature helps in identifying the specific configuration:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS-10** | Series identification (Advanced Thermal Solutions) |
| **H** | Standard high-performance profile |
| **83** | Specific dimensions/fin geometry code |
| **C2** | Thermal Interface Material (T766) and Blue Anodized finish |
| **R0** | RoHS compliance status |
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### 4. Implementation Considerations
* **Airflow Direction:** Performance is highly dependent on the "LFM" (Linear Feet per Minute) of airflow. It is most effective when placed directly in the path of a chassis fan.
* **PCB Hole Pattern:** To use the push-pins, your Printed Circuit Board (PCB) must have pre-drilled holes matching the 30mm x 30mm footprint layout.
* **Application:** Commonly used in networking equipment, telecommunications, and industrial embedded systems where reliability is critical.
- ⤷
What is the mechanical hole pattern required for the push-pins of this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ What are the alternative attachment methods if the PCB does not have push-pin holes?