Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-10H-83-C2-R0

  • AI
    The **ATS-10H-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Details | | :--- | :--- | | **Part Number** | ATS-10H-83-C2-R0 | | **Heat Sink Type** | Push-Pin (Standard Square) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Resistance** | Approx. 1.80°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features * **High-Performance Fin Pattern:** This model typically uses a **Straight Fin** or **Cross-Cut** pattern. This maximizes surface area while maintaining a low pressure drop, making it ideal for systems with forced-air cooling (fans). * **Push-Pin Attachment:** The part uses a spring-loaded push-pin mechanism. This provides: * **Consistent Pressure:** Ensures the heat sink is pressed firmly against the chip for maximum heat transfer. * **Secure Mounting:** Resistant to vibration and shock compared to adhesive tapes. * **T766 Phase Change Material:** The "C2" in the part number indicates it comes with a high-quality thermal interface material pre-applied to the base. This eliminates the need for manual thermal paste application. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration: | Code Segment | Meaning | | :--- | :--- | | **ATS-10** | Series identification (Advanced Thermal Solutions) | | **H** | Standard high-performance profile | | **83** | Specific dimensions/fin geometry code | | **C2** | Thermal Interface Material (T766) and Blue Anodized finish | | **R0** | RoHS compliance status | --- ### 4. Implementation Considerations * **Airflow Direction:** Performance is highly dependent on the "LFM" (Linear Feet per Minute) of airflow. It is most effective when placed directly in the path of a chassis fan. * **PCB Hole Pattern:** To use the push-pins, your Printed Circuit Board (PCB) must have pre-drilled holes matching the 30mm x 30mm footprint layout. * **Application:** Commonly used in networking equipment, telecommunications, and industrial embedded systems where reliability is critical.
    ✨ Follow-up Questions
    • ⤷ What is the mechanical hole pattern required for the push-pins of this heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ What are the alternative attachment methods if the PCB does not have push-pin holes?