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  • ATS-10H-92-C2-R0

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    The **ATS-10H-92-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Type** | pushPIN™ | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Fin Style** | Straight (High-flow design) | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS to define the product's attributes: * **ATS-10**: Refers to the product series (pushPIN™ Heat Sink). * **H**: Denotes the Fin Pitch (H = High performance/Fine pitch). * **92**: The internal design code/size identifier. * **C2**: Indicates the material and finish (Aluminum with Blue Anodize). * **R0**: Revision code for the specific thermal performance or kit version. --- ### 3. Key Features and Applications The ATS-10H-92-C2-R0 is engineered for modern electronic assemblies where space is limited but thermal loads are significant. * **pushPIN™ Attachment:** It utilizes a specialized spring-loaded attachment mechanism that ensures even pressure across the component for optimal heat transfer. * **High Flow Design:** The straight-fin pattern is optimized for environments with forced-air cooling (fans), providing low pressure drop. * **Pre-Applied Thermal Interface (TIM):** It comes with **T766** thermal material already applied to the base, which simplifies the assembly process and ensures a reliable thermal bond. * **Applications:** * Network switches and routers. * Embedded computing boards. * Power supplies and industrial controllers. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 16.48 | | 300 (1.5 m/s) | 6.62 | | 500 (2.5 m/s) | 4.41 | ---
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'Blue Anodized' finish in thermal management?
    • ⤷ How does the pushPIN mounting system compare to standard adhesive tapes?
    • ⤷ Are there alternative dimensions available in the ATS-10 series?