ATS-10H-95-C2-R0
AI

The **ATS-10H-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 30mm |
| **Thermal Resistance** | 7.29 °C/W (at 100 LFM) |
| **Airflow Pattern** | Fine-Pitch (Straight Fin) |
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### 2. Design Components
#### A. Fin Geometry
This heat sink uses a **straight-fin design**. This provides a large surface area for heat transfer and is optimized for forced-air cooling environments (systems with fans).
#### B. Attachment: pushPIN™ System
The "10H" in the part number indicates a specific push-pin assembly.
* **Ease of Install:** It uses a spring-loaded pin mechanism that snaps into pre-drilled holes on the PCB.
* **Consistent Pressure:** The spring ensures uniform pressure across the thermal interface material (TIM), maximizing heat transfer efficiency.
#### C. Thermal Interface Material (TIM)
The "C2" suffix indicates that the unit comes pre-applied with **ATS-T766** thermal grease. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink.
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### 3. Application Use-Cases
* **Embedded Systems:** Cooling processors in industrial computers.
* **Telecommunications:** Used on high-speed data chips.
* **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.
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### 4. Thermal Performance Data
Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 7.29 |
| 200 (1.0 m/s) | 2.48 |
| 500 (2.5 m/s) | 1.10 |
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- ⤷
What are the alternative attachment methods to the pushPIN system for this heat sink?
- ⤷ How do I calculate the required LFM for a specific chip TDP using this heat sink?
- ⤷ What is the difference between the C2 and C1 suffixes in ATS part numbers?