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  • ATS-10H-95-C2-R0

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    The **ATS-10H-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Airflow Pattern** | Fine-Pitch (Straight Fin) | --- ### 2. Design Components #### A. Fin Geometry This heat sink uses a **straight-fin design**. This provides a large surface area for heat transfer and is optimized for forced-air cooling environments (systems with fans). #### B. Attachment: pushPIN™ System The "10H" in the part number indicates a specific push-pin assembly. * **Ease of Install:** It uses a spring-loaded pin mechanism that snaps into pre-drilled holes on the PCB. * **Consistent Pressure:** The spring ensures uniform pressure across the thermal interface material (TIM), maximizing heat transfer efficiency. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the unit comes pre-applied with **ATS-T766** thermal grease. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink. --- ### 3. Application Use-Cases * **Embedded Systems:** Cooling processors in industrial computers. * **Telecommunications:** Used on high-speed data chips. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.29 | | 200 (1.0 m/s) | 2.48 | | 500 (2.5 m/s) | 1.10 | ---
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods to the pushPIN system for this heat sink?
    • ⤷ How do I calculate the required LFM for a specific chip TDP using this heat sink?
    • ⤷ What is the difference between the C2 and C1 suffixes in ATS part numbers?