The **ATS-1184-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling high-power electronic components such as CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the ATS-1184-C1-R0: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic or Brass) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | ~3.0°C/W (at 200 LFM) | | **Airflow Direction** | Omnidirectional (Cross-cut fins) | --- ### 2. Key Design Components #### A. Fin Geometry (maxiFLOW™) Unlike standard straight-fin heat sinks, the ATS-1184 uses a unique tapered fin design. This maximizes the surface area for heat dissipation while minimizing the pressure drop. The "cross-cut" pattern allows for airflow from any direction, making it ideal for crowded PCB layouts where airflow might be irregular. #### B. pushPIN™ Attachment The "C1" in the part number often refers to the specific attachment kit. The **pushPIN™** system provides: * **Constant Pressure:** Ensures the thermal interface material (TIM) is compressed evenly for maximum heat transfer. * **Ease of Assembly:** Quick installation through pre-drilled holes in the PCB. * **Reliability:** High resistance to shock and vibration compared to adhesive tapes. #### C. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the unit comes with a pre-applied high-performance thermal pad or phase-change material on the base, reducing the thermal resistance between the component die and the heat sink. --- ### 3. Application Use Cases This specific part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling networking switches and routers. 2. **Industrial PCs:** Thermal management for embedded processors. 3. **Power Supplies:** Heat dissipation for high-voltage regulators. ---