The **ATS-11A-101-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** line, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Series** | pushPIN™ | High performance thermal management | | **Material** | Aluminum | Blue Anodized finish | | **Dimensions** | 45 x 45 x 30 mm | Large surface area for heat dissipation | | **Mounting Type** | Push-pin | Easy, tool-free installation | | **Spring Type** | ATS-PPS-11 | Consistent pressure for thermal contact | | **Thermal Resistance** | 6.67 °C/W (undirected) | Efficiency at 100 LFM | | **Attachment Method** | Push-Pin | Secure mechanical locking | --- ### 2. Breakdown of the Model Code To understand the electronic application, we can decode the part number suffixing: - **ATS-11A**: Identifies the base series and physical size (45mm). - **101**: Refers to the specific fin pattern and height configuration (30mm height). - **C2**: Indicates the material and finish (Blue Anodized Aluminum). - **R0**: Refers to the revision and packaging type. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 6.67 | | **300** | 2.22 | | **500** | 1.45 | | **700** | 1.17 | --- ### 4. Component Features - **High Aspect Ratio Fins:** The design uses a "straight fin" or "cross-cut" pattern to maximize the surface area exposed to moving air. - **Pre-Assembled Thermal Interface Material (TIM):** Most units come with a pre-applied phase-change material or thermal pad to ensure low thermal resistance between the chip and the heat sink. - **Spring-Loaded Fasteners:** The push-pin mechanism uses a specific spring tension (ATS-PPS-11) to ensure even pressure across the die, preventing air gaps that cause overheating. --- ### 5. Application Examples This part is commonly found in: 1. **Network Switches:** Cooling high-speed processing ASICs. 2. **Industrial PCs:** Providing passive or active cooling in rugged environments. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.