The **ATS-11A-151-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling integrated circuits (ICs) and other PCB components. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~9.0°C/W (at 200 LFM) | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Attachment System (Push-Pin) The "C2" in the part number signifies the specific attachment mechanism. * **Brass Push-Pins:** These provide a secure, vibration-resistant mount to the PCB. * **Compression Springs:** These ensure consistent "Downward Pressure" (Load), which optimizes the contact between the heat sink base and the electronic component. #### B. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * This is a phase-change or high-conductivity pad that fills microscopic air gaps between the heat sink and the chip, significantly lowering thermal impedance. #### C. Fin Design * **Straight Fins:** Optimized for longitudinal airflow. It is most effective in systems with a dedicated cooling fan providing "forced convection." --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying variations: | Segment | Meaning | | :--- | :--- | | **ATS-11** | Series (Push-pin heat sink) | | **A** | Material/Attachment style | | **151** | Dimension/Height identifier | | **C2** | Attachment hardware (Brass pin + Spring) | | **R0** | RoHS compliance status | --- ### 4. Application Use-Cases This specific heat sink is typically used for: * **CPUs/GPUs:** Small form factor processors or embedded chips. * **FPGAs/ASICs:** High-speed logic gates that generate localized heat. * **Northbridge/Southbridge:** Motherboard chipsets. * **Telecommunications:** Network switches and routers where PCB space is at a premium.