ATS-11B-30-C2-R0
AI

The **ATS-11B-30-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
| Parameter | Specification |
|:---|:---|
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ Heat Sink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 30.00mm x 30.00mm |
| **Height** | 25.00mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Resistance** | 13.17 °C/W (at 100 LFM) |
| **Spring Type** | Compression Spring |
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### 2. Design and Component Features
The part consists of several integrated electronic cooling elements:
#### A. The Heat Sink Body
The body is made of extruded aluminum, which provides a high level of thermal conductivity while remaining lightweight. The fins are arranged in a **cross-cut** or high-performance pattern to maximize surface area and facilitate airflow from multiple directions.
#### B. The Push-Pin Mechanism
Unlike adhesive-based heat sinks, the "C2" designation refers to the specific **Brass Push-Pin** attachment.
* **Reliability:** It provides consistent pressure against the component, ensuring a solid thermal interface.
* **Ease of Assembly:** It allows for quick installation through pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number indicates the specific thermal interface material.
* **Pre-applied TIM:** It comes with a phase-change material or high-performance grease pre-applied to the base to reduce thermal resistance between the component and the sink.
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### 3. Thermal Performance (Air Flow)
Thermal resistance decreases as airflow (Linear Feet per Minute) increases:
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
|:---|:---|:---|
| 100 | 0.5 | 13.17 |
| 300 | 1.5 | 4.42 |
| 500 | 2.5 | 3.12 |
| 700 | 3.5 | 2.57 |
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### 4. Part Number Breakdown
The code `ATS-11B-30-C2-R0` is structured as follows:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **11:** Series identifier.
* **B:** Aluminum material.
* **30:** Width (30mm).
* **C2:** Attachment style (Push-pin type).
* **R0:** Thermal interface material type.
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What are the PCB hole requirements for installing this push-pin heat sink?
- ⤷ How does blue anodizing affect the thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used with a custom fan attachment?