The **ATS-11B-33-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance **maxiFLOW™** series of heat sinks, designed specifically for cooling integrated circuits (ICs) and other electronic components. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-11B-33-C2-R0 | | **Type** | Heat Sink | | **Shape** | Square / Rectangular | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 17.78mm | --- ### Key Electronic & Physical Features #### 1. maxiFLOW™ Design The "maxiFLOW" geometry features a spread-fin design. This increases the surface area exposed to the airflow while minimizing pressure drop. In electronics, this is critical for cooling densely packed PCBs where airflow might be obstructed. #### 2. pushPIN™ Attachment Instead of using messy thermal adhesives or tapes, this part utilizes the **pushPIN™** system. This involves: * A brass or plastic pin with a built-in spring. * Precise pressure applied to the component (TIM - Thermal Interface Material). * Easy installation and removal without damaging the chip. #### 3. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and electrical insulation for the surface of the sink. #### 4. Thermal Interface Material (TIM) The "C2" in the part number usually indicates that the heat sink comes pre-applied with **ATS-54** or similar high-performance thermal grease, ensuring there are no air gaps between the processor and the heat sink. --- ### Application in Circuitry This component is typically found in: * **Processors/FPGAs:** Cooling high-speed logic chips. * **Power Supplies:** Dissipating heat from voltage regulators. * **Telecommunications:** Used in routers and switches where reliability is paramount. ---