The **ATS-11B-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for cooling high-power electronic components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Thermal Resistance** | 2.52°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Dimensions** | 57.6mm x 76.2mm x 15mm | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Tapered Fin (High Performance) | --- ### 2. Key Components and Features #### A. The Heat Sink Body The device utilizes a **Tapered Fin** design. Unlike standard rectangular fins, these are shaped to maximize surface area while reducing pressure drop. This allows more air to flow through the sink, carrying heat away more efficiently. #### B. pushPIN™ Attachment System This is the "electronic mounting" part of the assembly. It consists of: * **Plastic/Brass Push Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Stainless Steel Springs:** These provide consistent "Force-on-Die," ensuring the heat sink stays pressed against the electronic chip with the correct pressure. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific thermal interface (pre-applied thermal grease or pad) used on the base of the heat sink. This fills the microscopic air gaps between the chip and the metal to ensure maximum heat transfer. --- ### 3. Application Use Cases In electronic systems, this part is typically used for: 1. **Telecommunications:** Cooling high-speed switching silicon. 2. **Industrial PC (IPC):** Managing thermals in ruggedized computing environments. 3. **Power Supplies:** Dissipating heat from MOSFETs or IGBTs. --- ### 4. Part Number Breakdown ```text ATS - 11 B - 34 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Thermal Interface Material (TIM) | | | +------------ Height (15mm) | | +----------------- Fin Pitch/Density | +------------------- Series Number +------------------------- Manufacturer (Advanced Thermal Solutions) ```