The **ATS-11B-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic) | | **Length x Width** | 40mm x 40mm | | **Height** | 10mm | | **Thermal Resistance** | ~17.40°C/W (at 200 LFM) | | **Fin Style** | Straight Fin (Extruded) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **11B** | Series Designator (Push-Pin attachment type) | | **35** | Footprint/Geometry code (40mm x 40mm) | | **C2** | Thermal Interface Material (TIM) pre-applied (T766) | | **R0** | RoHS Compliant / Revision status | --- ### 3. Key Electronic Functions * **Heat Dissipation:** Its primary role is to increase the surface area of an electronic component to facilitate heat transfer to the surrounding air. * **Thermal Interface Material (TIM):** The "C2" suffix indicates it comes with a pre-applied phase-change or thermal tape. This ensures there are no microscopic air gaps between the chip and the aluminum, maximizing thermal conductivity. * **Mechanical Integrity:** The push-pin mechanism uses a spring-loaded system. This provides consistent pressure across the surface of the chip, preventing "hot spots" caused by uneven contact. --- ### 4. Application Environments This part is commonly found in: * **Networking Gear:** Switches and Routers. * **Industrial PCs:** Compact motherboards with limited vertical clearance. * **Embedded Systems:** For heat dissipation on FPGA or ASIC chips where height is restricted to 10mm.