The **ATS-11B-36-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for high-efficiency cooling in constrained spaces. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 14.48mm | | **Thermal Resistance** | 4.82°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Airflow Pattern** | maxiFLOW™ (Flared fin design) | | **Fin Style** | Straight | --- ### 2. Key Electronic Components & Design The "Electronic" aspect of this part refers to its integration into PCB (Printed Circuit Board) assemblies: * **maxiFLOW™ Geometry:** The fins are flared outwards. This design reduces pressure drop and increases the surface area exposed to airflow, which is critical for cooling power-dense electronic components like CPUs, GPUs, or ASICs. * **pushPIN™ Attachment:** This is a mechanical fastening system consisting of a brass or plastic pin and a compression spring. It ensures a consistent "Normal Force" is applied to the electronic chip, optimizing the contact between the chip surface and the heat sink. * **TIM (Thermal Interface Material):** Usually, these parts come with a pre-applied high-performance thermal pad or grease (such as ATS-54) to bridge the microscopic air gaps between the electronic component and the metal heat sink. --- ### 3. Part Number Breakdown The nomenclature provides specific details about the configuration: 1. **ATS-11B**: The series designation (pushPIN™ Heat Sink). 2. **36**: Refers to the footprint size (approx. 37mm). 3. **C2**: Indicates the specific thermal performance and material grade. 4. **R0**: Refers to the revision and packaging (usually RoHS compliant). --- ### 4. Applications This part is commonly found in the following electronic environments: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PC boards. * **Power Supplies:** Cooling MOSFETs or power regulators. ---