The **ATS-11B-46-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their high-performance "push-pin" heat sink series designed for cooling integrated circuits (ICs) such as CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~4.07 °C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ## 2. Key Component Breakdown ### A. Heat Sink Body (The Fin Profile) The "11B" series typically utilizes a **straight-fin** or **cross-cut** design. This specific model uses a square 40x40mm footprint with a low profile (15mm height), making it ideal for systems with limited vertical clearance (1U servers or compact embedded systems). ### B. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, this unit uses **brass push-pins**. * **Advantage:** Provides consistent downward pressure, ensuring optimal contact with the chip. * **Requirement:** The PCB must have pre-drilled holes to accommodate the pins. ### C. Thermal Interface Material (TIM) The part number suffix indicates it comes with **T766** pre-applied. * This is a high-performance phase-change material that softens at operating temperatures to fill microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ## 3. Part Number Decoder Understanding the "ATS-11B-46-C2-R0" nomenclature: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **11B**: Product series (specific fin geometry). * **46**: Dimensional code (refers to the 40x40mm size). * **C2**: Indicates the specific thermal performance/material grade. * **R0**: RoHS compliance/revision status. --- ### Application Use-Cases * **Networking Hardware:** Cooling ASICs in switches and routers. * **Industrial PCs:** Cooling embedded processors. * **Power Supplies:** Heat dissipation for high-output MOSFETs or power modules.