The **ATS-11B-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high cooling efficiency in constrained air-flow environments. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Thermal Resistance** | 3.30 °C/W @ 200 LFM (Linear Feet per Minute) | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 15.00mm | | **Fin Style** | Spread Fin (Tapered) | --- ## 2. Component Breakdown ### A. The maxiFLOW™ Design The "maxiFLOW" design uses a graduated fin pattern. Unlike standard straight-fin heat sinks, these fins are flared outward. This geometry: * Reduces pressure drop across the heat sink. * Increases the surface area for heat dissipation. * Allows for better airflow through the fins in low-speed air environments. ### B. pushPIN™ Attachment System The **-R0** suffix indicates the specific attachment hardware. The pushPIN™ system includes: * **A pre-assembled spring:** Ensures constant pressure (TIM - Thermal Interface Material) for maximum heat transfer. * **Nylon/Brass pins:** These snap into holes on the PCB, providing a secure mechanical fit that is vibration-resistant. ### C. Thermal Interface Material (TIM) The **-C2** designation typically refers to the type of thermal interface material pre-applied to the base. * **C2:** Usually indicates **ATS-PPS-2**, a high-performance thermal grease or phase-change material that fills microscopic air gaps between the electronic component (CPU/FPGA) and the heat sink base. --- ## 3. Part Number Decoder | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **11B** | Series/Product Family (maxiFLOW High Performance) | | **50** | Dimension/Variation Code | | **C2** | Thermal Interface Material (T766 or equivalent grease) | | **R0** | Revision/Standard Packaging with pushPIN | --- ## 4. Typical Applications This specific heat sink is commonly used for cooling "Hot" electronic components on a Printed Circuit Board (PCB), such as: * **FPGAs & ASICs:** Custom logic chips that generate localized heat. * **Processors:** High-speed embedded microcontrollers. * **Network Switches:** Components in high-density rack environments where airflow is directed by fans.