The **ATS-11B-66-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically designed to provide low thermal resistance and high surface area for cooling electronic components. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 1.15°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 35mm | | **Fin Style** | Tapered / High-Aspect Ratio | --- ### 2. Physical Design and Construction #### **The maxiFLOW™ Geometry** The "C2" in the part number refers to the specific geometry of the fins. These heat sinks feature a **flared fin** design. Unlike standard straight-fin heat sinks, flared fins increase the surface area and reduce the pressure drop of the air moving through them, which significantly enhances the cooling performance in forced-convection environments. #### **Material and Coating** * **Aluminum:** Lightweight with excellent thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization process creates an oxide layer that provides slight electrical insulation and improves surface emissivity, aiding in heat radiation. --- ### 3. Attachment Mechanism: pushPIN™ The **R0** suffix indicates the attachment hardware. This part uses a **pushPIN™** system: 1. **Spring-Loaded:** Provides a consistent "Normal Force" on the electronic component (CPU, GPU, or FPGA), ensuring optimal contact with the Thermal Interface Material (TIM). 2. **Secure Fit:** Prevents the heat sink from shifting during vibration or mechanical shock. 3. **Ease of Install:** Designed for quick assembly using pre-drilled holes in the PCB. --- ### 4. Typical Applications This part is commonly used to cool high-power integrated circuits (ICs) where space is limited but thermal loads are high: * **Networking Equipment:** Routers, switches, and base stations. * **Industrial Computing:** Embedded controllers and single-board computers. * **Power Electronics:** Voltage regulators and high-speed FPGAs. --- ### 5. Thermal Performance Data *Measured in Degrees Celsius per Watt (°C/W):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.15 | | 300 (1.5 m/s) | 0.90 | | 400 (2.0 m/s) | 0.75 |