The **ATS-11B-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 15.31°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Style** | Straight | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features ### A. maxiFLOW™ Fin Geometry The "68" in the part number refers to the specific fin design within the maxiFLOW™ family. These heat sinks feature a unique spread-fin pattern that increases the surface area for heat dissipation while maintaining a low pressure drop. This allows for higher efficiency in airflow-constrained environments. ### B. Attachment Mechanism (Push Pins) The **C2** designation indicates the attachment hardware. This model typically utilizes: * **Push Pins:** Provides a secure, tool-less attachment to the PCB. * **Compression Springs:** Ensures consistent pressure between the heat sink and the component, optimizing the performance of the Thermal Interface Material (TIM). ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance phase-change material. This ensures that the microscopic gaps between the heat sink and the electronic chip are filled, significantly reducing thermal resistance compared to a dry contact. --- ### 3. Applications The ATS-11B-68-C2-R0 is commonly used in the following electronic sectors: * **Telecommunications:** Cooling for high-speed routers and switches. * **Power Supplies:** Managing heat in voltage regulators and power converters. * **Computing:** Secondary cooling for chipsets, BGAs, and FPGAs. * **Industrial Automation:** Thermal protection for control board processors. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Brand). * **11B:** Part of the specific push-pin heat sink family. * **68:** Internal design code for fin height and density. * **C2:** Attachment hardware kit code. * **R0:** Revision/Standard finish code (Blue Anodized).