ATS-11B-70-C2-R0
AI

The **ATS-11B-70-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**, designed for cooling electronic components such as ICs (Integrated Circuits), BGA (Ball Grid Array) packages, and processors.
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### 1. Technical Specifications
The model number provides specific details about its physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Base Dimensions** | 45mm x 45mm |
| **Height** | 25mm |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 1.20°C/W (at 200 LFM) |
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### 2. Key Design Elements
#### A. Fin Pattern (Cross-Cut)
This unit features a **cross-cut** fin design. Unlike straight-fin heat sinks, the cross-cut pattern allows for air to flow from multiple directions. This makes it highly efficient in "crowded" PCB environments where airflow might be turbulent or non-linear.
#### B. pushPIN™ Attachment
The "C2" in the part number indicates the specific attachment kit. This system uses:
* **Compression Springs:** Provide precise pressure to ensure optimal thermal contact between the heat sink and the chip.
* **Plastic/Brass Pins:** Secure the unit through pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
Usually, these parts come with a pre-applied **Phase Change Material** or thermal tape. For the R0 variant, it typically features **T766** thermal interface material, which fills microscopic air gaps to improve heat transfer efficiency.
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### 3. Application Use-Cases
This heat sink is typically used in the following electronic sectors:
1. **Telecommunications:** Cooling for high-speed routers and switches.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Electronics:** Dissipating heat from voltage regulators or power modules.
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### 4. Part Number Breakdown
* **ATS**: Advanced Thermal Solutions.
* **11B**: Specific series/designator.
* **70**: Specific length/width configuration.
* **C2**: Attachment hardware type (pushPIN).
* **R0**: RoHS compliance and revision status.
- ⤷
What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ How does the Blue Anodized finish affect the thermal performance compared to bare aluminum?
- ⤷ What is the weight of the ATS-11B-70-C2-R0 for vibration-sensitive applications?