The **ATS-11B-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications Below are the primary technical parameters for the ATS-11B-79-C2-R0: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height (Fin Profile)** | 20mm | | **Thermal Resistance** | 26.36 °C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Fine Pitch (COARSE-PITCH) | --- ### 2. Physical Design and Construction The part is engineered to maximize surface area within a small footprint: * **Heat Sink Body:** Extruded from high-grade aluminum for optimal thermal conductivity. * **Fin Style:** It utilizes a **Straight Fin** design, which is effective for both natural convection and forced-air environments. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a high-performance phase-change material that ensures minimal thermal resistance between the heat source (CPU/GPU) and the sink. --- ### 3. Mounting Mechanism (pushPIN™) The "R0" suffix refers to the specific mounting hardware used to secure the part to the PCB: 1. **Brass Pins & Stainless Steel Springs:** The push-pin mechanism provides a consistent, calculated pressure (clamping force) on the electronic component. 2. **Ease of Assembly:** It allows for quick installation and removal without the need for complex tools, reducing the risk of board damage during maintenance. 3. **Vibration Resistance:** The spring-loaded nature of the pins makes it suitable for high-vibration industrial or automotive environments. --- ### 4. Thermal Performance Comparison Thermal performance varies based on the Airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 26.36 | | 200 (1.0 m/s) | 13.90 | | 400 (2.0 m/s) | 8.45 | | 600 (3.0 m/s) | 6.54 | --- ### 5. Application Areas This part is commonly found in: * **Networking Gear:** Switches and routers. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** Base station electronic modules.