Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-11B-95-C2-R0

  • AI
    The **ATS-11B-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-11B-95-C2-R0 | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | ~1.50 °C/W (varies with airflow) | | **Thermal Interface Material** | T766 (Pre-applied thermal grease) | --- ### 2. Key Electronic Features #### A. Thermal Management (Heat Dissipation) The primary role of this part is to increase the surface area of a semiconductor package. By transferring heat from the silicon die to the aluminum fins, it prevents **thermal throttling** or permanent damage caused by overheating. #### B. maxiFLOW™ Design Unlike standard extruded heat sinks, the maxiFLOW™ geometry features a **flared fin structure**. This design: * Reduces pressure drop. * Increases surface area for convection. * Optimizes airflow in constrained electronic enclosures. #### C. pushPIN™ Attachment System This part uses a specific mechanical mounting system: * **Compression Springs:** Ensure even pressure across the electronic chip for optimal thermal contact. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). --- ### 3. Common Applications * **Network Switches & Routers:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where space is limited but heat density is high. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** Cooling RF components and transceivers. --- ### 4. Part Number Breakdown The suffix `C2-R0` provides specific manufacturing details: * **C2:** Refers to the specific thermal interface material (T766) and the color/finish (Blue Anodized). * **R0:** Indicates the RoHS (Restriction of Hazardous Substances) compliance status and revision level.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN™ attachment?
    • ⤷ How does the thermal resistance change at different air velocities (LFM)?
    • ⤷ Is there a copper-base version of this heat sink for higher heat loads?