ATS-11B-95-C2-R0
AI

The **ATS-11B-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and ASICs.
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### 1. Technical Specifications
The following table outlines the key physical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Base Part Number** | ATS-11B-95-C2-R0 |
| **Dimensions (L x W x H)** | 40mm x 40mm x 30mm |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | ~1.50 °C/W (varies with airflow) |
| **Thermal Interface Material** | T766 (Pre-applied thermal grease) |
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### 2. Key Electronic Features
#### A. Thermal Management (Heat Dissipation)
The primary role of this part is to increase the surface area of a semiconductor package. By transferring heat from the silicon die to the aluminum fins, it prevents **thermal throttling** or permanent damage caused by overheating.
#### B. maxiFLOW™ Design
Unlike standard extruded heat sinks, the maxiFLOW™ geometry features a **flared fin structure**. This design:
* Reduces pressure drop.
* Increases surface area for convection.
* Optimizes airflow in constrained electronic enclosures.
#### C. pushPIN™ Attachment System
This part uses a specific mechanical mounting system:
* **Compression Springs:** Ensure even pressure across the electronic chip for optimal thermal contact.
* **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB).
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### 3. Common Applications
* **Network Switches & Routers:** Cooling high-speed processing chips.
* **Embedded Systems:** Industrial PCs where space is limited but heat density is high.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
* **Telecommunications:** Cooling RF components and transceivers.
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### 4. Part Number Breakdown
The suffix `C2-R0` provides specific manufacturing details:
* **C2:** Refers to the specific thermal interface material (T766) and the color/finish (Blue Anodized).
* **R0:** Indicates the RoHS (Restriction of Hazardous Substances) compliance status and revision level.
- ⤷
What are the PCB hole requirements for the pushPIN™ attachment?
- ⤷ How does the thermal resistance change at different air velocities (LFM)?
- ⤷ Is there a copper-base version of this heat sink for higher heat loads?