The **ATS-11D-05-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs in high-density environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 9.30°C/W (Unducted Flow @ 100 LFM) | | **Pressure Drop** | High-performance foil fin design | --- ### 2. Key Components & Materials The part is comprised of three primary sub-components: 1. **Heat Sink Body:** Manufactured from aluminum for high thermal conductivity. The "C2" in the part number indicates a blue anodized finish, which provides surface protection and slightly improves radiation heat transfer. 2. **Thermal Interface Material (TIM):** Pre-applied **T766** phase-change material or grease is typically included on the base to ensure maximum contact between the component die and the heat sink. 3. **Push-Pin & Spring:** It uses a plastic push-pin with a specific compression spring to provide precise, consistent pressure across the component surface, ensuring optimal heat transfer without cracking the silicon die. --- ### 3. Part Number Decoder Understanding the "ATS-11D-05-C2-R0" nomenclature helps identify its specific configuration: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **11:** Series number (Foil-fin design). * **D:** Attachment type (Push-Pin). * **05:** Fin height (Approximate height code). * **C2:** Material/Finish (Aluminum / Blue Anodized). * **R0:** Revision code / Packaging. --- ### 4. Application Example In a typical PCB layout, this heat sink would be mounted over a high-heat component using pre-drilled holes in the board. ```python # Conceptual Calculation for Thermal Budget def calculate_junction_temp(ambient_temp, power_watts, thermal_resistance): # Tj = Ta + (Pd * Rtheta) return ambient_temp + (power_watts * thermal_resistance) # Example: 5W chip in 40°C environment junction_temp = calculate_junction_temp(40, 5, 9.30) print(f"Projected Junction Temp: {junction_temp}°C") ```