The **ATS-11D-10-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to provide efficient cooling for integrated circuits (ICs) and other surface-mount components. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heatsink Type** | push-pin (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Straight Fin | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | Approx. 3.42°C/W (@ 200 LFM) | | **Attachment Method** | Plastic push-pin with Brass Spring | | **Interface Material** | T766 (Thermal Tape) | --- ## 2. Component Breakdown ### A. The Heatsink Body * **Geometry:** It features a square footprint of 45mm, making it suitable for larger BGA (Ball Grid Array) packages. * **Height:** The 25mm height allows for significant surface area for heat dissipation but requires vertical clearance in the chassis. * **Material:** Extruded aluminum is used for its high thermal conductivity and lightweight properties. The **Blue Anodized** finish increases emissivity and protects against corrosion. ### B. The Push-Pin Mechanism Unlike adhesive-only heatsinks, the "11D" series uses a mechanical attachment system: * **Push-Pins:** These are inserted through pre-drilled holes in the PCB. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heatsink base and the chip, which minimizes the thermal resistance at the interface. ### C. Thermal Interface Material (TIM) The **C2** suffix indicates that the part comes pre-applied with **T766 thermal phase-change material** or high-performance tape. This fills the microscopic air gaps between the component and the heatsink. --- ## 3. Performance Summary The performance of this part is highly dependent on the airflow (Linear Feet per Minute - LFM) within the system. | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 3.42 | | **300 (1.5 m/s)** | 2.50 | | **400 (2.0 m/s)** | 2.10 | | **500 (2.5 m/s)** | 1.80 | --- ### Key Applications * **Telecommunications:** Cooling of high-speed processors and ASICs. * **Computing:** Heat dissipation for chipsets and power modules. * **Industrial Electronics:** Ensuring stability in high-ambient temperature environments.