The **ATS-11D-100-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). ### Technical Specifications Below are the primary electronic and mechanical specifications for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Push-Pin | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 4.07°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Attachment Method** | Plastic Push-Pin with Brass Spring | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### Key Component Parts #### 1. Heat Sink Body The body is constructed from extruded aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodize** finish is not just aesthetic; it provides increased surface emissivity and corrosion resistance. #### 2. Fin Geometry This model uses a **Straight Fin** design. * **Purpose:** It is optimized for "undirected" airflow within a chassis. * **Performance:** The vertical fins allow air to pass through from various angles, maximizing the surface area available for heat dissipation from the electronic component (CPU, GPU, or FPGA) to the ambient air. #### 3. Attachment Mechanism: Push-Pin and Spring Unlike adhesive-based heat sinks, the ATS-11D-100-C2-R0 uses a mechanical attachment: * **Push-Pin:** A plastic fastener that snaps into pre-drilled holes on the PCB (Printed Circuit Board). * **Compression Spring:** A brass spring provides consistent downward pressure. This ensures that the heat sink maintains firm contact with the electronic chip, which is critical for minimizing thermal interface resistance. #### 4. Thermal Interface Material (TIM) The base of the heat sink comes pre-applied with **T766**. * **Function:** TIM fills the microscopic air gaps between the heat sink base and the electronic component surface. * **Benefit:** Since air is a poor conductor of heat, the T766 paste/pad significantly improves the heat transfer rate. --- ### Application in Electronics This part is commonly used to cool integrated circuits (ICs) that generate significant heat during operation, such as: * High-speed microprocessors. * Application-Specific Integrated Circuits (ASICs). * Network switches and routers. * Power conversion modules.