The **ATS-11D-153-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling electronic components such as CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Value / Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~4.05 °C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components * **Heat Sink Body:** The 40mm x 40mm footprint is standard for many square integrated circuits. The 20mm height provides a balance between surface area for heat dissipation and clearance for compact enclosures. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. This ensures consistent pressure on the chip, improving heat transfer and allowing for easier removal/re-installation. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization process increases surface emissivity, which helps slightly with radiation cooling and provides corrosion resistance. * **Pre-Applied TIM:** The unit comes with **T766 thermal interface material**, which eliminates the need for manual application of thermal paste, ensuring a uniform layer and efficient heat path from the silicon to the aluminum. --- ### 3. Application Use Cases This part is typically used in environments where active or passive airflow is present: 1. **Networking Hardware:** Routers, switches, and gateway processors. 2. **Industrial PCs:** Cooling controllers in environments with high ambient temperatures. 3. **Power Supplies:** Cooling voltage regulators or power modules. --- ### 4. Thermal Performance Comparison The effectiveness of this heat sink varies based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 6.46 | | **200 LFM** | 4.05 | | **400 LFM** | 2.59 | | **600 LFM** | 1.91 |