The **ATS-11D-16-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling electronic components such as CPUs, GPUs, or high-power ASICs on printed circuit boards (PCBs). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Thermal Resistance** | 1.80°C/W @ 200 LFM | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Breakdown #### A. The Heat Sink Body * **Fin Design:** It utilizes a **cross-cut** or **straight fin** geometry (depending on the specific sub-series airflow optimization). This design maximizes surface area while allowing multidirectional airflow to dissipate heat. * **Material:** Extruded aluminum is used for its excellent thermal conductivity-to-weight ratio. The blue anodized finish provides corrosion resistance and increased emissivity. #### B. The Push-Pin Attachment System * **Mechanism:** The "11D" designation refers to the specific push-pin and spring assembly. * **Benefit:** Push-pins provide a secure, standardized mechanical connection to the PCB. This ensures consistent pressure on the component, which is critical for effective heat transfer. * **Springs:** The springs are calibrated to apply a specific amount of force (load) to the component without damaging the silicon or the PCB traces. #### C. Thermal Interface Material (TIM) * **T766:** The unit comes with **T766** phase-change material or high-performance thermal grease pre-applied to the base. * **Function:** This fills the microscopic air gaps between the heat source (chip) and the heat sink base to ensure maximum thermal conduction. --- ### 3. Application Use Cases This specific model is commonly found in: * **Telecommunications:** Cooling networking switches and routers. * **Industrial Computing:** Maintaining temperatures in embedded PC systems. * **Power Supplies:** Dissipating heat from MOSFETs or power regulators. --- ### 4. Part Number Decoder Understanding the "ATS" naming convention: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **11D:** Specific attachment kit (Push-pin type). * **16:** Fin height/designator. * **C2:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Revision or packaging code.