ATS-11D-20-C2-R0
AI

The **ATS-11D-20-C2-R0** is a specific part number for a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin** series of thermal management components.
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### 1. Technical Specifications
The part number can be decoded to understand its specific physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm |
| **Thermal Resistance** | 3.33 °C/W @ 200 LFM (Linear Feet per Minute) |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (High Performance Pre-applied) |
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### 2. Core Components & Design
The ATS-11D-20-C2-R0 is engineered for efficient heat dissipation in electronic assemblies:
* **Fins:** It features a **Straight Fin** design. This allows for maximum airflow through the heat sink, making it ideal for systems with directed air movement (e.g., cooling fans).
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses brass push-pins. This provides a secure, reliable mechanical connection to the PCB, ensuring constant pressure between the heat sink and the component.
* **The "C2" Identifier:** This typically refers to the specific material and finish (Blue Anodized Aluminum). The anodized coating protects against corrosion and improves thermal emissivity.
* **Pre-applied TIM:** It comes with a T766 thermal phase-change material already applied to the base, which simplifies the assembly process and ensures a low thermal-resistance interface.
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### 3. Application Use Cases
This component is generally used to cool high-heat generating integrated circuits (ICs) such as:
1. **CPUs and Microprocessors** in industrial PCs.
2. **FPGA/ASIC** chips in networking equipment.
3. **Power Electronics** in telecommunications infrastructure.
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### 4. Part Number Breakdown (Pattern)
```text
ATS - 11D - 20 - C2 - R0
| | | | |
| | | | └── Revision Code
| | | └────── Finish/Material (Blue Anodized)
| | └─────────── Height/Design Variable
| └───────────────── Series (Push-Pin)
└─────────────────────── Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ What are the advantages of push-pin mounting versus thermal tape?
- ⤷ Can this heat sink be used for passive cooling without a fan?