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  • ATS-11D-20-C2-R0

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    The **ATS-11D-20-C2-R0** is a specific part number for a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin** series of thermal management components. --- ### 1. Technical Specifications The part number can be decoded to understand its specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Thermal Resistance** | 3.33 °C/W @ 200 LFM (Linear Feet per Minute) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (High Performance Pre-applied) | --- ### 2. Core Components & Design The ATS-11D-20-C2-R0 is engineered for efficient heat dissipation in electronic assemblies: * **Fins:** It features a **Straight Fin** design. This allows for maximum airflow through the heat sink, making it ideal for systems with directed air movement (e.g., cooling fans). * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses brass push-pins. This provides a secure, reliable mechanical connection to the PCB, ensuring constant pressure between the heat sink and the component. * **The "C2" Identifier:** This typically refers to the specific material and finish (Blue Anodized Aluminum). The anodized coating protects against corrosion and improves thermal emissivity. * **Pre-applied TIM:** It comes with a T766 thermal phase-change material already applied to the base, which simplifies the assembly process and ensures a low thermal-resistance interface. --- ### 3. Application Use Cases This component is generally used to cool high-heat generating integrated circuits (ICs) such as: 1. **CPUs and Microprocessors** in industrial PCs. 2. **FPGA/ASIC** chips in networking equipment. 3. **Power Electronics** in telecommunications infrastructure. --- ### 4. Part Number Breakdown (Pattern) ```text ATS - 11D - 20 - C2 - R0 | | | | | | | | | └── Revision Code | | | └────── Finish/Material (Blue Anodized) | | └─────────── Height/Design Variable | └───────────────── Series (Push-Pin) └─────────────────────── Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ What are the advantages of push-pin mounting versus thermal tape?
    • ⤷ Can this heat sink be used for passive cooling without a fan?