The **ATS-11D-25-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The part number reveals specific physical and thermal characteristics according to the ATS naming convention: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 40mm x 40mm x 25mm | | **Thermal Resistance** | ~3.26 °C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design and Components #### A. Fin Geometry (XC-Cut) This model features a **Straight-Fin** or **Cross-Cut** design. The "XC" or "D" designation often refers to the specific airflow optimization. The fins provide a large surface area for heat dissipation into the surrounding air. #### B. Push-Pin Attachment Instead of using adhesive tape or thermal glue, this part uses mechanical **Push-Pins**: * **Material:** Typically brass or plastic. * **Benefit:** Provides consistent pressure on the processor, ensuring optimal contact with the Thermal Interface Material (TIM). * **Reliability:** Mechanical mounting is more vibration-resistant than chemical adhesives. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change or high-performance pad that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance. --- ### 3. Applications This heat sink is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Managing heat for MOSFETs or voltage regulators. 4. **Computing:** Chipset cooling on motherboards. --- ### 4. Thermal Performance Data (Estimation) The efficiency of the heat sink depends heavily on the Airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 3.26 | | 400 (2.0 m/s) | 1.90 | | 600 (3.0 m/s) | 1.48 | ---