The **ATS-11D-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for secure and efficient cooling of electronic integrated circuits (ICs). --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-11D-32-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions** | 54mm x 54mm x 12.7mm | | **Thermal Resistance** | 2.49 °C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### Key Electronic Components & Design Features #### 1. Heat Sink Geometry (Fin Design) The ATS-11D-32-C2-R0 utilizes a **High-Performance Square Fin** design. This geometry maximizes surface area while maintaining a low profile (12.7mm height), making it ideal for systems with limited vertical clearance but high airflow. #### 2. Attachment Mechanism: Push-Pins Unlike adhesive-based heatsinks, this model uses **brass push-pins with springs**. - **Benefit:** It provides consistent pressure (compression) on the electronic component, which improves heat transfer efficiency. - **Reliability:** It is more vibration-resistant than thermal tape, making it suitable for industrial or networking hardware. #### 3. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a specialized material that fills the microscopic air gaps between the heatsink base and the electronic chip (CPU, FPGA, or ASIC), ensuring optimal thermal conductivity. #### 4. Material and Finish - **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodization:** Beyond aesthetics, the anodized coating provides corrosion resistance and slightly improves radiative heat transfer. --- ### Common Applications This part is typically found in the following electronic systems: * **Networking Gear:** Switches and routers where ASICs generate significant heat. * **Embedded Systems:** Industrial PCs and motherboards. * **Telecommunications:** Base station hardware and signal processing units. ---