The **ATS-11D-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 20mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 1.74°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Compression Spring** | Provided for consistent pressure | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Detailed Electronic Part Components The "Part Number" can be broken down to understand the specific electronic and mechanical properties: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **11D:** Refers to the specific series and mounting hole pattern. * **33:** Refers to the specific dimensions/footprint (35mm x 35mm). * **20:** Refers to the height (20mm). * **C2:** Indicates the finish (Blue Anodized) and thermal performance grade. * **R0:** Revision code. --- ### 3. Functional Features #### Mounting Mechanism Unlike adhesive-based heat sinks, the **ATS-11D-33-C2-R0** uses a mechanical **Push-Pin** system. * **Precision:** Ensures high-reliability attachment in high-vibration environments. * **Spring Load:** The brass push-pin includes a compression spring that provides a specific amount of downward force, ensuring the Thermal Interface Material (TIM) makes optimal contact with the semiconductor. #### Thermal Performance The straight-fin design is optimized for **forced air-flow** environments (fans). The aluminum construction provides a lightweight yet efficient medium for heat dissipation from components such as CPUs, GPUs, or high-power FPGAs. #### Pre-Applied TIM The unit comes with **T766 thermal phase-change material**. This eliminates the need for manual application of thermal paste, reducing assembly time and ensuring a consistent thermal bond. ---