The **ATS-11D-40-C2-R0** is a specific high-performance heat sink assembly manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Blue Anodized Aluminum | | **Fin Type** | High-density straight fin | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W)** | 30mm x 30mm | | **Height** | 25mm | | **Thermal Resistance** | ~12.11 °C/W (at 200 LFM) | | **TIM (Interface Material)** | T766 (Pre-applied) | --- ## 2. Key Electronic & Mechanical Components ### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which offers a balance between thermal conductivity and weight. The blue anodized finish is not just aesthetic; it provides surface protection and slightly improves emissivity for radiant heat transfer. ### B. Push-Pin Attachment System Instead of using messy adhesives or thermal tape, the "11D" series uses a mechanical push-pin system: * **Pins:** Brass components that snap into pre-drilled holes on the PCB. * **Springs:** Provides consistent pressure (clamping force) on the chip to ensure maximum contact with the thermal interface material. ### C. Thermal Interface Material (TIM) The **C2** suffix indicates the type of thermal interface material pre-applied to the base. * **T766:** This is a high-performance phase-change material or grease that fills microscopic air gaps between the heat sink and the electronic component to lower thermal resistance. --- ## 3. Application Use Cases This specific part is typically found in: 1. **Networking Hardware:** Switches and routers where airflow is constant. 2. **Embedded Systems:** Industrial PCs where mechanical vibration requires a secure push-pin mount rather than adhesive. 3. **Power Supplies:** Cooling voltage regulators or small power modules. --- ## 4. Airflow Performance The effectiveness of this part depends heavily on Linear Feet per Minute (LFM) of airflow: * **Low Airflow (200 LFM):** ~12.11 °C/W * **Moderate Airflow (400 LFM):** ~7.16 °C/W * **High Airflow (600 LFM):** ~5.59 °C/W