The **ATS-11D-48-C2-R0** is a specific high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" thermal management series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 7.59 °C/W (at 1.0 m/s airflow) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height** | 25.00 mm | | **Fin Style** | Fine-Pitch (High surface area) | | **TIM (Thermal Interface)** | T766 (Pre-applied phase change material) | --- ## 2. Key Component Features ### A. pushPIN™ Attachment System This part utilizes a specialized mounting system that replaces traditional adhesive tapes or screws. * **Spring-loaded mechanism:** Ensures consistent pressure between the heat sink and the electronic component, optimizing heat transfer. * **Tool-less Installation:** Designed for quick assembly onto the PCB. ### B. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes with **T766 thermal grease** pre-applied to the base. This fills microscopic air gaps between the heat sink and the chip to lower thermal resistance. ### C. Fine-Pitch Design The fins are densely packed to maximize the surface area exposed to airflow. This makes it ideal for environments with forced-air cooling (fans). --- ## 3. Applications The ATS-11D-48-C2-R0 is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling of networking chips and routers. 2. **Embedded Systems:** For industrial PCs where space is constrained but heat density is high. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---