The **ATS-11D-55-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Ice" or standard push-pin thermal management series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific data regarding its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 23.98 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 10mm | --- ### 2. Breakdown of the Part Number The nomenclature follows a specific logic used by ATS to identify the heat sink's physical build: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **11D**: Refers to the specific fin design and series. * **55**: Internal code for the physical dimensions (40x40mm footprint). * **C2**: Material and Finish code (typically refers to Aluminum with Blue Anodized finish). * **R0**: Revision or specific packaging version. --- ### 3. Key Electronic/Mechanical Components To function as a complete thermal solution, this part utilizes several integrated elements: #### A. Fin Design (Cross-Cut) The heat sink features a **straight fin** or **cross-cut** design. This increases surface area, allowing air to pass through more efficiently. It is optimized for both natural convection and forced air (fan-driven) cooling. #### B. Attachment: Push-Pin & Spring Instead of adhesive tape, this model uses a mechanical push-pin system: - **Push-Pins:** Usually made of nylon or brass. - **Springs:** Pre-assembled compression springs ensure the correct amount of downward pressure (clamping force) is applied to the electronic chip, maximizing thermal transfer. #### C. Thermal Interface Material (TIM) The "R0" often indicates that a **Thermal Interface Material** (like T766 or a phase-change pad) is pre-applied to the bottom of the heat sink. This fills microscopic air gaps between the component and the heat sink. --- ### 4. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Industrial PCs:** Heat dissipation for embedded processors. 3. **Power Supplies:** Cooling MOSFETs or power regulators.