The **ATS-11D-57-C2-R0** is a high-performance thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These parts are critical for dissipating heat from electronic components like CPUs, GPUs, or high-power ASICs to prevent thermal throttling or hardware failure. --- ### 1. Key Technical Specifications Below is a breakdown of the electronic and mechanical characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized Blue) | | **Attachment Type** | Push-Pin (Plastic) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 13.16°C/W (at 100 LFM) to 3.12°C/W (at 800 LFM) | | **Dimensions** | 40mm x 40mm x 15mm | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Physical and Mechanical Construction The "electronic" functionality of this part is passive, relying on surface area and material conductivity: * **Heat Spread (Base):** The base is a solid aluminum plate that makes direct contact with the electronic component. * **Dissipation Surface (Fins):** The straight-fin design allows for linear airflow. It is optimized for forced-air cooling (fan-driven) rather than natural convection. * **Push-Pin Mechanism:** The "11D" series uses a spring-loaded push-pin system. This ensures consistent pressure between the heatsink and the chip, which is vital for maintaining a low thermal resistance path. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in selecting the correct electronic cooling solution: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **11D** | Series (Push-pin attachment style) | | **57** | Specific dimension and fin configuration code | | **C2** | Color/Finish (Anodized Blue) | | **R0** | Revision or specific packaging code | --- ### 4. Thermal Performance Data Thermal management in electronics is measured by the temperature rise over the ambient per watt of power generated (°C/W). * **Low Airflow (200 LFM):** ~7.92 °C/W * **High Airflow (600 LFM):** ~3.59 °C/W **Usage Note:** To use this part effectively, the electronic PCB must have two pre-drilled holes spaced according to the ATS-11D mechanical footprint to accept the push-pins. ---