ATS-11D-60-C2-R0
AI

The **ATS-11D-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling semiconductor components such as CPUs, GPUs, or high-power ASICs.
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### 1. Technical Specifications
The model number encodes specific physical and thermal characteristics:
| Property | Specification | Details |
| :--- | :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions | Model: ATS-11D-60-C2-R0 |
| **Material** | Aluminum | Blue Anodized Finish |
| **Dimensions** | 45mm x 45mm x 25mm | Standard square footprint |
| **Attachment Type** | Push Pin | Standard 2-pin attachment |
| **Fin Type** | Fine Pitch (Straight) | Optimized for high-velocity airflow |
| **Thermal Resistance** | ~1.42 °C/W | (Varies based on airflow velocity) |
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### 2. Key Component Features
* **Material and Finish:** The unit is made from high-grade aluminum. The **blue anodized coating** is not just for aesthetics; it provides corrosion resistance and slightly improves thermal emissivity.
* **Thermal Interface Material (TIM):** The "R0" suffix usually indicates that the unit comes pre-applied with **Chomerics T766** phase-change material or similar high-performance thermal pad, ensuring low interface resistance between the chip and the sink.
* **Push-Pin Mechanism:** It utilizes a spring-loaded push-pin system. This provides consistent downward pressure (clamping force), which is critical for maximizing heat transfer efficiency.
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### 3. Thermal Performance Profile
The effectiveness of this heat sink depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure:
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 6.36 |
| 400 (2.0 m/s) | 2.50 |
| 600 (3.0 m/s) | 1.50 |
| 800 (4.0 m/s) | 1.10 |
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### 4. Implementation Considerations
1. **Hole Pattern:** The PCB must have specific pre-drilled holes to accommodate the push pins. For this series, the hole spacing is typically centered at **38mm**.
2. **Vertical Clearance:** With a height of 25mm, this is a "mid-profile" heat sink. Ensure there is enough vertical clearance in the chassis for airflow to circulate above the fins.
3. **Flow Direction:** Because it uses straight fins (not cross-cut), the airflow should ideally be directed parallel to the fins for maximum cooling.
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What is the exact hole spacing required on the PCB for this model?
- ⤷ How does the blue anodized coating impact thermal performance compared to bare aluminum?
- ⤷ Are there low-profile alternatives in the same series for compact builds?