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  • ATS-11D-68-C2-R0

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    ## Technical Specifications for ATS-11D-68-C2-R0 The **ATS-11D-68-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors in compact environments. --- ### 1. Key Physical & Thermal Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | push-PIN™ | | **Fin Type** | Fine Pitch (Straight) | | **Dimension (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 200 LFM) | | **Flow Orientation** | Vertical or Horizontal | --- ### 2. Major Electronic/Mechanical Components The part is not an "active" electronic device (like a transistor) but a **passive thermal management component**. Below are its functional parts: * **Heat Sink Body:** Extruded aluminum designed with a high surface area to volume ratio to maximize heat dissipation from the electronic component to the ambient air. * **push-PIN™ Mounting:** This is a mechanical attachment system. It includes a spring-loaded pin that passes through pre-drilled holes in the Printed Circuit Board (PCB), ensuring constant pressure and optimal contact between the heat sink and the chip. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. TIM fills microscopic air gaps between the component and the heat sink to reduce thermal resistance. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves radiative heat transfer. --- ### 3. Application Use Cases 1. **High-Speed Networking:** Cooling chipsets in routers and switches. 2. **Industrial Computing:** Used for processors in embedded systems where space is limited (15mm height). 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules. --- ### 4. Thermal Performance Data (Airflow) | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 m/s (200 LFM) | 15.31 | | 2.0 m/s (400 LFM) | 6.81 | | 3.0 m/s (600 LFM) | 5.02 |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-PIN mounting system?
    • ⤷ Is this heat sink compatible with custom thermal interface materials?
    • ⤷ How does the blue anodized finish impact long-term reliability?