ATS-11D-68-C2-R0
AI

## Technical Specifications for ATS-11D-68-C2-R0
The **ATS-11D-68-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors in compact environments.
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### 1. Key Physical & Thermal Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | push-PIN™ |
| **Fin Type** | Fine Pitch (Straight) |
| **Dimension (L x W x H)** | 45mm x 45mm x 15mm |
| **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 200 LFM) |
| **Flow Orientation** | Vertical or Horizontal |
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### 2. Major Electronic/Mechanical Components
The part is not an "active" electronic device (like a transistor) but a **passive thermal management component**. Below are its functional parts:
* **Heat Sink Body:** Extruded aluminum designed with a high surface area to volume ratio to maximize heat dissipation from the electronic component to the ambient air.
* **push-PIN™ Mounting:** This is a mechanical attachment system. It includes a spring-loaded pin that passes through pre-drilled holes in the Printed Circuit Board (PCB), ensuring constant pressure and optimal contact between the heat sink and the chip.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. TIM fills microscopic air gaps between the component and the heat sink to reduce thermal resistance.
* **Blue Anodized Finish:** Provides corrosion resistance and slightly improves radiative heat transfer.
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### 3. Application Use Cases
1. **High-Speed Networking:** Cooling chipsets in routers and switches.
2. **Industrial Computing:** Used for processors in embedded systems where space is limited (15mm height).
3. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules.
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### 4. Thermal Performance Data (Airflow)
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 1.0 m/s (200 LFM) | 15.31 |
| 2.0 m/s (400 LFM) | 6.81 |
| 3.0 m/s (600 LFM) | 5.02 |
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What are the PCB hole requirements for the push-PIN mounting system?
- ⤷ Is this heat sink compatible with custom thermal interface materials?
- ⤷ How does the blue anodized finish impact long-term reliability?