The **ATS-11D-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the unit: | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 45mm x 45mm x 10mm | | **Thermal Resistance (Unducted)** | 14.95 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.33 °C/W @ 100 LFM | | **Fin Type** | Fine Pitch (Straight) | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Efficiency The heat sink is designed for **forced air cooling**. In a ducted environment (where airflow is concentrated), the thermal resistance drops significantly (from ~15 °C/W to ~2.33 °C/W), making it highly efficient for high-density PCB layouts. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical fastening system: * **Secure Fit:** Prevents the heat sink from shifting due to vibration or thermal expansion. * **Constant Pressure:** A pre-assembled compression spring ensures uniform pressure across the interface material, optimizing heat transfer. * **Compatibility:** Designed for pre-drilled holes in the PCB. #### C. Material and Coating * **Aluminum 6063:** Provides a balance of high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just aesthetic; the anodization increases surface emissivity and provides corrosion resistance and electrical insulation for the surface of the sink. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying specific variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **11** | Series / Design Type | | **D** | Material / Attachment Variation | | **75** | Specific Geometry / Fin Height | | **C1** | Performance Category / Thermal Interface Material | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Application Context This part is typically found in: * **Telecommunications:** Cooling of high-speed network switches. * **Embedded Systems:** Industrial PCs where space (10mm height) is at a premium. * **Power Supplies:** Cooling of MOSFETs or voltage regulators.