The **ATS-11D-82-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance thermal management line, specifically designed as a heat sink solution for cooling semiconductors and integrated circuits. --- ### 1. Component Overview This part is a **push-pin heat sink** designed for use in electronic assemblies where space and thermal efficiency are critical. It utilizes a "cross-cut" fin design to maximize surface area and improve airflow from multiple directions. ### 2. Technical Specifications Below are the primary physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized Blue) | | **Heat Sink Type** | Push-Pin (Spring-loaded) | | **Fin Style** | Straight/Cross-cut (High Flow) | | **Thermal Resistance** | ~10.79 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Attachment Method** | Plastic Push-Pins with Brass Springs | | **Interface Material** | T766 (Pre-applied Thermal Phase Change Material) | --- ### 3. Structural Components The "Electronic Parts" breakdown of this assembly includes: 1. **Heat Sink Body:** Extruded aluminum finished with a blue anodized coating. Anodization not only prevents corrosion but also increases surface emissivity, slightly improving radiation heat transfer. 2. **Push-Pin Fasteners:** Made of durable plastic (usually Nylon). These provide the mechanical force required to keep the heat sink in contact with the PCB. 3. **Compression Springs:** Often made of brass or stainless steel. These ensure consistent downward pressure (clamping force) on the electronic chip, compensating for thermal expansion and vibration. 4. **Thermal Interface Material (TIM):** This is the "grey pad" on the bottom. In the C2-R0 model, it typically features a high-performance phase-change material that melts slightly at operating temperatures to fill microscopic air gaps between the chip and the sink. --- ### 4. Part Number Breakdown (Decoding) To understand the specific configuration of this part: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **11D:** Series designation (specific fin geometry). * **82:** Dimension code (30mm x 30mm footprint). * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code. --- ### 5. Typical Applications * **CPUs/GPUs:** Small form factor processors. * **FPGAs:** Cooling logic arrays in telecommunications. * **Power Modules:** MOSFETs or IGBTs requiring localized cooling. * **Embedded Systems:** Industrial PCs where fan-less or forced-air cooling is utilized.