The **ATS-11D-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 35.00mm | | **Thermal Resistance** | 5.63°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Breakdown #### A. The Fin Design (High Performance) The unit features a **Fine Pitch** straight-fin design. This maximizes the surface area available for heat dissipation while maintaining a low profile. The 35mm height is categorized as a high-profile sink for its footprint, suitable for cases with vertical clearance. #### B. Push-Pin Attachment Mechanism Instead of using adhesive tapes or standard screws, this part uses a **brass push-pin** with a stainless steel spring. * **Benefits:** Provides consistent pressure (clamping force) across the interface, improving thermal transfer. * **Reliability:** It is more secure than thermal tape in high-vibration environments. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * This is a high-performance phase-change or thermal grease material. * It ensures that microscopic air gaps between the component (chip) and the heat sink are filled, minimizing thermal impedance. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow (Velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.63 | | 200 (1.0 m/s) | 1.81 | | 400 (2.0 m/s) | 1.02 | | 600 (3.0 m/s) | 0.80 | --- ### 4. Application Use Cases * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs where mechanical stability is required. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.