The **ATS-11D-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for efficient heat dissipation in integrated circuits (ICs). --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-11D-97-C2-R0 | | **Heat Sink Type** | Push-Pin Mount (XC Cut) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.03°C/W @ 200 LFM | | **Attachment Method** | Plastic Push-Pin & Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | --- ### Key Features and Electronic Functionality #### 1. Push-Pin Attachment Mechanism This part utilizes a standardized push-pin system. This is critical for PCB (Printed Circuit Board) design because: * It provides consistent pressure across the interface for optimal thermal transfer. * The pins are designed for specific hole diameters (typically 3mm) on the motherboard or PCB. #### 2. Material and Finish The heat sink is made of **Aluminum 6063**, which is the industry standard for thermal conductivity in lightweight applications. The **Blue Anodized** finish is not just for aesthetics; it provides: * Increased corrosion resistance. * Electrical insulation (to a degree) on the surface. * Improved emissivity for radiant heat transfer. #### 3. High-Performance Fin Design The "XC Cut" or straight-fin design is optimized for **forced air cooling**. In an electronic enclosure with fans, the air flows through these fins to carry heat away from components like CPUs, GPUs, or high-power ASICs. #### 4. Thermal Interface Material (TIM) The "R0" suffix usually denotes that the part comes with a pre-applied **Phase Change Material (PCM)** or thermal tape. This eliminates the need for manual application of thermal paste, ensuring a reliable thermal bond between the chip and the heat sink. --- ### Typical Applications * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and high-speed controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators.