The **ATS-11D-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components like CPUs, GPUs, and high-density ICs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Material** | Aluminum (Blue Anodized finish) | | **Thermal Resistance** | 11.51°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 45mm x 45mm x 20mm | --- ### 2. Physical Design Features The part utilizes the **pushPIN™** system, which is highly reliable for mounting to PCBs. Key physical attributes include: * **Heat Sink Base:** 45mm x 45mm square base providing a large contact surface area. * **Fin Height:** 20mm height, allowing for significant surface area for heat dissipation without being overly bulky. * **Cross-Cut Fin Pattern:** The fins are designed with a cross-cut pattern, which increases turbulence and improves cooling efficiency in varied airflow directions. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal pad/grease to bridge the gap between the chip and the aluminum. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the heat sink moves heat away from the component. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.51 | | 200 (1.0 m/s) | 4.03 | | 300 (1.5 m/s) | 2.31 | | 500 (2.5 m/s) | 1.39 | --- ### 4. Component Interaction * **Spring-Loaded Mounting:** The push-pin uses a compression spring to ensure constant, even pressure on the electronic component, preventing air gaps that reduce cooling efficiency. * **Compatibility:** Designed for standard hole patterns on PCBs, ensuring it doesn't interfere with surrounding surface-mount devices (SMDs). ---