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  • ATS-11F-128-C2-R0

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    The **ATS-11F-128-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push pin" series designed for cooling integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 2.91°C/W (at 200 LFM) | | **Dimension (L x W x H)** | 54mm x 54mm x 15mm | | **Fin Style** | Straight Fin (Extrusion) | --- ### 2. Design Characteristics * **Heat Sink Profile:** The device uses a high-density straight fin design. This maximizes surface area for convective cooling while maintaining a low profile (15mm) suitable for compact electronic enclosures. * **Attachment Mechanism:** The `R0` suffix indicates a specific mounting kit. It utilizes **Push Pins** with a pre-loaded spring. This ensures consistent pressure (TIM compression) and secure mechanical attachment to the PCB without the need for adhesive tapes. * **Thermal Interface Material (TIM):** Most components in this series come with a pre-applied high-performance thermal pad (often T766) to ensure low contact resistance between the chip and the aluminum base. --- ### 3. Part Number Breakdown (Example) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **11** | Series designation (Push-Pin series) | | **F** | Fin style (Fine/Straight) | | **128** | Size and configuration code | | **C2** | Blue Anodized finish | | **R0** | Packaging/Revision/Mounting Kit specific | --- ### 4. Applications * **Networking:** Cooling for high-speed routers and switches. * **Industrial PC:** Cooling processors in fanless or low-airflow environments. * **Automotive:** Thermal management for ADAS modules and control units.
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve optimal thermal resistance for this heat sink?
    • ⤷ How does the Push Pin mounting compare to adhesive thermal tape in terms of reliability?
    • ⤷ Are there specific PCB hole dimensions required for the ATS-11F series?