The **ATS-11F-13-C2-R0** is a specific electronic part number representing a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed for cooling integrated circuits (ICs) and high-power components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics of the device. | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Thermal Resistance** | 2.52°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height** | 17.50 mm | | **Fin Style** | Spread Fin (Tapered) | --- ### 2. Design and Engineering Features * **maxiFLOW™ Technology:** The heat sink features a unique "flared" fin structure. This design increases the surface area and encourages more efficient airflow through the fins, reducing the pressure drop compared to standard straight-fin heat sinks. * **pushPIN™ Attachment:** This model utilizes a spring-loaded pin mechanism. This provides a precise, pre-calculated pressure on the component, ensuring optimal thermal interface material (TIM) performance and preventing damage to the PCB. * **Blue Anodized Coating:** The blue coating is not just aesthetic; it provides surface protection against corrosion and slightly improves heat radiation. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variations of this part: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **11** | Series Number (pushPIN™ maxiFLOW) | | **F** | Fin Pitch/Designation | | **13** | Specific Height/Configuration Code | | **C2** | Thermal Interface Material (Typically T766 phase change or similar) | | **R0** | Revision or RoHS Compliance indicator | --- ### 4. Application Use-Cases This heat sink is typically used in environments where high-speed airflow is available (forced convection) to cool high-density electronic assemblies: * **Networking Hardware:** Switches, routers, and high-speed modems. * **Embedded Systems:** Industrial PCs and processing modules. * **Power Supplies:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).