The **ATS-11F-134-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** product line, designed specifically for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Material** | Aluminum (Body) / Copper (optional base variation) | | **Thermal Resistance** | 1.32°C/W (at 200 LFM) | | **Dimensions** | 57.90mm x 60.96mm | | **Height** | 17.78mm | | **Finish** | Blue Anodized | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (maxiFLOW™) Unlike standard straight-fin heat sinks, the maxiFLOW design uses a tapered, "flared" fin structure. This maximizes surface area while maintaining a low pressure drop, allowing for better airflow intake from all directions. #### B. pushPIN™ Attachment System The part number suffix indicates the hardware used for mounting. The pushPIN™ system includes: * **Compression Springs:** Provides consistent pressure (7-10 lbs) on the component for optimal thermal contact. * **Plastic or Brass Pins:** Snaps into pre-drilled holes on the PCB (Printed Circuit Board) for a secure, vibration-resistant fit. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number usually specifies the thermal pad or grease pre-applied to the base. * **Material:** Usually a Phase Change Material (PCM) or high-performance thermal pad. * **Purpose:** Fills microscopic air gaps between the heat sink and the electronic chip to improve heat transfer efficiency. --- ### 3. Mechanical Drawing Summary | Dimension Parameter | Value (mm) | | :--- | :--- | | **Width (A)** | 57.90 | | **Length (B)** | 60.96 | | **Height (C)** | 17.78 | | **Pitch (E)** | 48.26 | | **Pitch (F)** | 50.80 | --- ### 4. Thermal Performance Context The performance of this part is highly dependent on the air velocity (LFM - Linear Feet per Minute) within the electronic enclosure: 1. **Low Airflow (200 LFM):** ~1.32°C/W thermal resistance. 2. **High Airflow (800 LFM):** ~0.60°C/W thermal resistance. This makes the ATS-11F-134-C2-R0 ideal for **1U or 2U server chassis** and **telecommunication equipment** where space is limited but high-velocity cooling is available.