The **ATS-11F-15-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** product line, specifically designed to provide high thermal performance in environments with restricted airflow. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Part Number** | ATS-11F-15-C2-R0 | | **Thermal Resistance** | 2.43 °C/W @ 200 LFM | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 15.00mm | | **Attachment Pitch** | 43.00mm | --- ### 2. Key Design Elements #### A. maxiFLOW™ Fin Geometry The fins are designed with a unique "flared" profile. This geometry maximizes the surface area for heat dissipation while minimizing the pressure drop. It is particularly effective in forced-convection environments (fans/blowers). #### B. pushPIN™ Attachment System Instead of simple adhesive tape, this model uses the **pushPIN™** system: * **Spring-loaded mechanism:** Ensures consistent pressure on the processor/component. * **Reliability:** Better vibration resistance compared to thermal tape. * **Installation:** Requires pre-drilled holes on the PCB at a 43mm pitch. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes pre-applied with **ATS-PPS-11**, a high-performance thermal grease. This ensures optimal heat transfer from the electronic component to the aluminum body without requiring manual application. --- ### 3. Electronic Application Use Cases This heat sink is typically found in the following electronic assemblies: * **Telecommunications:** Cooling ASICs and FPGAs in networking switches. * **Embedded Systems:** Industrial PCs where vertical space is limited (15mm height). * **Power Electronics:** Cooling high-speed voltage regulators or power modules.